Submicron Ag-coated Cu particles as filler in sintering paste: Suppression of Ag dewetting and improvement of sinterability by surface modification using stearic acid
作者机构：Department of Materials Science and Engineering Seoul National University of Science and Technology 232 Gongneung-ro Low-Carbon Integration Tech Creative Research Section ETRI 218 Gajeong-ro Materials Research Institute for Future Convergence Seoul National University of Science and Technology 232 Gongneung-ro
出 版 物：《Transactions of Nonferrous Metals Society of China》 (中国有色金属学报(英文版))
年 卷 期：2024年
核心收录：
学科分类：080901[工学-物理电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学]
基 金：supported by the National Research Foundation of Korea (NRF) grant funded by the Korea government (MSIT) (No: 2021R1A2C1007400) supported, partly, by the National R&D Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science and ICT (NRF-2020M3H4A3106383, NRF-2020M3H4A3081764) supported, partly, by ETRI (21YB1610) supported by a Korea Institute for Advancement of Technology (KIAT) grant funded by the Korea Government (MOTIE) (P0008458, HRD Program for Industrial Innovation)
摘 要：Four types of submicron Ag-coated Cu particles with different Ag contents were prepared as sintering paste fillers， and the Ag contents of the particles were measured to be 10， 20， 30， and 40 wt%. Four types of particles （in order of increasing Ag content: A10， A20， A30， and A40） were surface-modified with stearic acid， to suppress the Ag shell dewetting and improve sinterability. The surface-modified particles were mixed with a polyol-based solvent to fabricate a resin-free paste. Subsequently， the pastes were screen-printed onto a slide glass and sintered at 250 ℃ in a nitrogen atmosphere for 1–10 min to form an electrode. The electrical resistivity of the sintered film as a function of sintering time was measured using a four-point probe. All the four surface-modified Cu@Ag particles with different Ag contents exhibited decreased electrical resistivity. Particularly， the largest difference in values after and before the surface modification was observed for A40 with the highest Ag content; the electrical resistivities of the initial and surface-modified particles were 1.51×10-4and 6.67×10-5Ω·cm， respectively， after sintering for 10 min. The findings of this study confirmed that the surface modification using stearic acid effectively suppressed the dewetting of the Ag shell and improved the sinterability of the submicron Cu@Ag particles.
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