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A C-shaped hinge for displacement magnification in MEMS rotational structures

作     者:Naga Manikanta Kommanaboina Teferi Sitotaw Yallew Alvise Bagolini Maria F.Pantano 

作者机构:Department of CivilEnvironmental and Mechanical EngineeringUniversity of Trentovia Mesiano 7738123 TrentoItaly Fondazione Bruno Kessler(FBK)Microsystems Technology(MST)via S.Croce 7738122 TrentoItaly 

出 版 物:《Microsystems & Nanoengineering》 (微系统与纳米工程(英文))

年 卷 期:2024年第10卷第1期

页      面:55-66页

核心收录:

学科分类:07[理学] 070205[理学-凝聚态物理] 0804[工学-仪器科学与技术] 0805[工学-材料科学与工程(可授工学、理学学位)] 0702[理学-物理学] 

基  金:supported by the project“MONolithic STRain Engineering platform for TWO-Dimensional materials(MONSTRE 2D)”funded by the MIUR Progetti di Ricerca di Rilevante Interesse Nazionale(PRIN)Bando 2017-grant 2017 Prot.2017KFMJ8E. 

主  题:shaped displacement structures 

摘      要:The design,analysis,fabrication,and characterization of two distinct MEMS rotational structures are provided;these structures include a classical symmetrical lancet structure and a novel symmetrical C-shaped structure provided with a tilted arm,and both are actuated by thermal actuators.Our proposed C-shaped structure implemented a curved beam mechanism to enhance the movement delivered by the thermal actuators.The geometrical parameters of our proposed device were optimized using the design of experiment(DOE)method.Furthermore,the analytical modeling based on Castigliano’s second theorem and the simulations based on the finite element method(FEM)were used to predict the behavior of the symmetrical C-shaped structure;the results were in good agreement with each other.The MEMS-based rotational structures were fabricated on silicon-on-insulator(SOI)wafers using bulk micromachining technology and deep reactive ion etching(DRIE)processes.The fabricated devices underwent experimental characterization;our results showed that our proposed MEMS rotational structure exhibited a 28%improvement in the delivered displacement compared to the symmetrical lancet structure.Furthermore,the experimental results showed good agreement with those obtained from numerical analysis.Our proposed structures have potential applications in a variety of MEMS devices,including accelerometers,gyroscopes,and resonators,due to their ability to maximize displacement and thus enhance sensitivity.

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