Carbon nanotube integrated circuit technology:purification,assembly and integration
作者机构:State Key Laboratory for Manufacturing Systems EngineeringXi’an Jiaotong UniversityXi’an 710049People’s Republic of China
出 版 物:《International Journal of Extreme Manufacturing》 (极端制造(英文))
年 卷 期:2024年第6卷第3期
页 面:120-138页
核心收录:
学科分类:080903[工学-微电子学与固体电子学] 081702[工学-化学工艺] 0809[工学-电子科学与技术(可授工学、理学学位)] 07[理学] 070205[理学-凝聚态物理] 08[工学] 0817[工学-化学工程与技术] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程(可授工学、理学学位)] 0702[理学-物理学]
基 金:supported by National Natural Science Foundation of China(Grant No.52022078) Shaanxi Provincial Key Research and Development Program(Grant No.2021ZDLGY10-02,2019ZDLGY01-09)
主 题:carbon nanotubes integrated circuits field-effect transistors post-Moore
摘 要:As the manufacturing process of silicon-based integrated circuits(ICs)approaches its physical limit,the quantum effect of silicon-based field-effect transistors(FETs)has become increasingly *** the burgeoning carbon-based semiconductor technology has become one of the most disruptive technologies in the post-Moore *** one-dimensional nanomaterials,carbon nanotubes(CNTs)are far superior to silicon at the same technology nodes of FETs because of their excellent electrical transport and scaling properties,rendering them the most competitive material in the next-generation ICs ***,certain challenges impede the industrialization of CNTs,particularly in terms of material preparation,which significantly hinders the development of CNT-based *** on CNT-based ICs technology,this review summarizes its main technical status,development trends,existing challenges,and future development directions.