Prediction of undeformed chip thickness distribution and surface roughness in ultrasonic vibration grinding of inner hole of bearings

作     者：Yanqin LI Daohui XIANG Guofu GAO Feng JIAO Bo ZHAO Yanqin LI;Daohui XIANG;Guofu GAO;Feng JIAO;Bo ZHAO

作者机构：School of Mechanical and Power EngineeringHenan Polytechnic UniversityJiaozuo 454000China 

出 版 物：《Journal of Zhejiang University-Science A(Applied Physics & Engineering)》 (浙江大学学报（英文版）A辑（应用物理与工程）)

年 卷 期：2024年第25卷第4期

页      面：311-323页

核心收录：

学科分类：08[工学] 0812[工学-计算机科学与技术（可授工学、理学学位）] 0702[理学-物理学] 

基　　金：supported by the National Key Research and Development Program of China(No.2018YFB2000402) the Open Fund Project of Xinchang Research Institute of Zhejiang University of Technology,and the Fundamental Research Funds for the Universities of Henan Province,China(No.NSFRF200102). 

主　　题：Ultrasonic vibration grinding Undeformed chip thickness(UCT) Distribution characteristics Surface roughness 

摘      要：Ultrasonic vibration grinding differs from traditional grinding in terms of its material removal mechanism.The randomness of grain-workpiece interaction in ultrasonic vibration grinding can produce variable chips and impact the surface roughness of workpiece.However,previous studies used iterative method to calculate the unformed chip thickness(UCT),which has low computational efficiency.In this study,a symbolic difference method is proposed to calculate the UCT.The UCT distributions are obtained to describe the stochastic interaction characteristics of ultrasonic grinding process.Meanwhile,the UCT distribution characteristics under different machining parameters are analyzed.Then,a surface roughness prediction model is established based on the UCT distribution.Finally,the correctness of the model is verified by experiments.This study provides a quick and accurate method for predicting surface roughness in longitudinal ultrasonic vibration grinding.