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Wafer-scale synthesis of twodimensional materials for integrated electronics

作     者:Zijia Liu Xunguo Gong Jinran Cheng Lei Shao Chunshui Wang Jian Jiang Ruiqing Cheng Jun He 

作者机构:Key Laboratory of Artificial Micro-and Nano-structures of Ministry of Educationand School of Physics and TechnologyWuhan UniversityWuhan 430072China Wuhan Guide Infrared Co.Ltd.Wuhan 430200China Global Sensor TechnologyWuhan 430200China 

出 版 物:《Chip》 (芯片(英文))

年 卷 期:2024年第3卷第1期

页      面:64-83页

核心收录:

学科分类:081704[工学-应用化学] 07[理学] 08[工学] 0817[工学-化学工程与技术] 070303[理学-有机化学] 0703[理学-化学] 

基  金:supported by National Natural Science Foundation of China(Nos.91964203,62274121,and 62104171) Wuhan Science and Technology Major Program(No.2022013702025186) R.C.also acknowledges support from the Young Elite Scientists Sponsorship Program by CAST(No.2022QNRC001) 

主  题:2D materials Wafer-scale synthesis 2D integrated devices Post-moore electronics 

摘      要:Two-dimensional(2D)van derWaals materials have attracted great interest and facilitated the development of post-Moore electronics owing to their novel physical properties and high compatibility with traditional microfabrication *** wafer-scale synthesis has become a critical challenge for large-scale integrated *** the wafer-scale synthesis approaches for some 2D materials have been extensively explored,the preparation of high-quality thin films with well-controlled thickness remains a big *** review focuses on the wafer-scale synthesis of 2D materials and their applications in integrated ***,several representative 2D layered materials including their crystal structures and unique electronic properties were ***,the current synthesis strategies of 2Dlayeredmaterials at thewafer scale,which are divided into“top-downand“bottom-up,were reviewed in ***,the applications of 2D materials wafer in integrated electrical and optoelectronic devices were ***,the current challenges and future prospects for 2D integrated electronics were *** is hoped that this reviewwill provide comprehensive and insightful guidance for the development of wafer-scale 2D materials and their integrated applications.

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