High-fidelity mode scaling via topologicaloptimized on-chip metalens for compact photonic interconnection

作     者：Yingli Ha Lijun Wang Yinghui Guo Mingbo Pu Fang Zou Xiong Li Yulong Fan Xiaoliang Ma Xiangang Luo 

作者机构：State Key Laboratory of Optical Technologies on Nano-Fabrication and Micro-EngineeringInstitute of Optics and ElectronicsChinese Academy of SciencesChengdu 610209China Research Center on Vector Optical FieldsInstitute of Optics and ElectronicsChinese Academy of SciencesChengdu 610209China School of OptoelectronicsUniversity of Chinese Academy of SciencesBeijing 100049China Tianfu Xinglong Lake LaboratoryChengdu 610299China 

出 版 物：《Light(Advanced Manufacturing)》 (光（先进制造）（英文）)

年 卷 期：2023年第4卷第3期

页      面：222-232页

学科分类：080901[工学-物理电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 080401[工学-精密仪器及机械] 0804[工学-仪器科学与技术] 0803[工学-光学工程] 

基　　金：funded by the National Key Research and Development Program under Grant 2021YFA1401000 National Natural Science Foundation of China(NSFC)under Grants 62222513,U20A20217 Postdoctoral Science Foundation of Sichuan under Grant J22S001 

主　　题：On-chip metalens Inverse design Phase collimate Photonic integrated circuits 

摘      要：Photonic integrated circuits(PICs)have attracted significant interest in communication,computation,and biomedical ***,most rely on highly integrated PICs devices,which require a low-loss and high-integration guided wave *** to the various dimensions of different integrated photonic devices,their interconnections typically require waveguide *** a waveguide taper can overcome the width mismatch of different devices,its inherent tapering width typically results in a long length,which fundamentally limits the efficient interconnection between devices with a high scaling ratio over a short ***,we proposed a highly integrated on-chip metalens that enables optical interconnections between devices with high width-scaling ratios by embedding a free-form metasurface in a silicon-on-insulator *** special geometric features endow the designed metalens with high coupling efficiency and high *** device has a footprint of only 2.35μm in the longitudinal direction and numerical aperture of 2.03,enabling beam focusing and collimation of less than 10μm between devices with width-scaling ratio of *** the fundamental transverse electric field(TE0)mode,the relative transmittance is as high as 96%for forward incidence(from wide to narrow waveguides),whereas the metalens can realize wavefront shaping for backward incidence,which can be used in optical phase *** study provides new ideas for optical interconnect design and wavefront shaping in high-integration *** design approach has potential applications in directional radiators,LiDAR,on-chip optical information processing,analogue computing,and imaging.