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Closed-Form Solution for a Circular Nanohole with Surface Effects Under Uniform Heat Flux

作     者:Jieyao Tang Jieyan Zhao Haibing Yang Cunfa Gao Jieyao Tang;Jieyan Zhao;Haibing Yang;Cunfa Gao

作者机构:State Key Laboratory of Mechanics and Control for Aerospace StructuresNanjing University of Aeronautics and AstronauticsNanjing 210016China School of Civil Engineering and TransportationSouth China University of TechnologyGuangzhou 510641China College of Mechanics and MaterialsHohai UniversityNanjing 211100China 

出 版 物:《Acta Mechanica Solida Sinica》 (固体力学学报(英文版))

年 卷 期:2024年第37卷第1期

页      面:43-52页

核心收录:

学科分类:08[工学] 0805[工学-材料科学与工程(可授工学、理学学位)] 0801[工学-力学(可授工学、理学学位)] 080102[工学-固体力学] 

基  金:supported by the National Natural Science Foundation of China(Grant No.11902116) the Natural Science Foundation of Guangdong Province(Grant No.2022A1515011773) the Natural Science Foundation of Guangzhou City(Grant No.202201010317). 

主  题:Circular nanohole Surface effect Thermal stress Heat flux 

摘      要:This paper investigates the steady-state thermoelastic problem of a circular nanohole embedded in an infinitely large elastic plane subjected to a uniform far-field heat flux.A lowly conductive surface model is used to account for the effects of surface phonon scattering,while the complete Gurtin–Murdoch model is utilized to characterize the effects of surface tension and surface elasticity.The closed-form solution to the temperature and stress field surrounding the hole is derived in the context of complex variable methods.Several numerical examples are presented to analyze the influence of surface effects on thermal stress fields.It is shown that surface effects induce notable increases in normal and shear stresses around the hole.Specifically,all three stress components(hoop,normal,and shear)in the vicinity of the hole exhibit substantial augmentation with increasing surface tension and surface modulus.In particular,it is found that the presence of surface effects amplifies the variation in stress gradients and intensifies stress concentration around the hole.

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