Preventing formation of intermetallic compounds in ultrasonic-assisted Sn soldering of Mg/Al alloys through pre-plating a Ni coating layer on the Mg substrate

作     者：Yingzong Liu Yuanxing Li Hui Chen Zongtao Zhu 

作者机构：Key Laboratory of Advanced Technologies of MaterialsMinistry of EducationSchool of Materials Science and EngineeringSouthwest Jiaotong UniversityChengdu 610031PR China 

出 版 物：《Journal of Magnesium and Alloys》 (镁合金学报（英文）)

年 卷 期：2024年第12卷第2期

页      面：726-741页

核心收录：

学科分类：080503[工学-材料加工工程] 0806[工学-冶金工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 080201[工学-机械制造及其自动化] 

基　　金：financial support from the National Natural Science Foundation of China(grant numbers 52275385 and U2167216) the Sichuan Province Science and Technology Support Program(grant number 2022YFG0086) 

主　　题：Ultrasonic-assisted soldering Mg_(2)Sn Ni coating layer Shear strength 

摘      要：Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of *** compounds(IMCs)affect the joint performance of Mg/*** this study,AZ31 Mg alloy with/without a nickel(Ni)coating layer and 6061 Al alloy were joined by ultrasonic-assisted soldering with Sn-3.0Ag-0.5Cu(SAC)*** effects of the Ni coating layer on the microstructure and mechanical properties of Mg/Al joints were systematically *** Ni coating layer had a significant effect on formation of the Mg_(2)Sn IMC and the mechanical properties of Mg/Al *** blocky Mg_(2)Sn IMC formed in the Mg/SAC/Al joints without a Ni coating *** content of the Mg_(2)Sn IMC increased with increasing soldering temperature,but the joint strength *** joint without a Ni coating layer fractured at the blocky Mg_(2)Sn IMC in the solder,and the maximum shear strength was 32.2 *** pre-plating Ni on the Mg substrate,formation of the blocky Mg_(2)Sn IMC was inhibited in the soldering temperature range 240–280℃and the joint strength ***,when the soldering temperature increased to 310℃,the blocky Mg_(2)Sn IMC precipitated again in the *** electron microscopy showed that some nano-sized Mg_(2)Sn IMC and the(Cu,Ni)_(6)Sn_(5)phase formed in the Mg(Ni)/SAC/Al joint soldered at 280℃,indicating that the Ni coating layer could no longer prevent diffusion of Mg into the solder when the soldering temperature was higher than 280℃.The maximum shear strength of the Mg(Ni)/SAC/Al joint was 58.2 MPa for a soldering temperature of 280℃,which was 80.7%higher than that of the Mg/SAC/Al joint,and the joint was broken at the Mg(Ni)/SAC ***-plating Ni is a feasible way to inhibit formation of IMCs when joining dissimilar metals.