Failure mechanisms in flexible electronics

作     者：Zhehui Zhao Haoran Fu Ruitao Tang Bocheng Zhang Yunmin Chen Jianqun Jiang 

作者机构：MOE Key Laboratory of Soft Soils and Geoenvironmental EngineeringZhejiang UniversityHangzhouChina Department of Civil EngineeringZhejiang UniversityHangzhouChina R&D departmentWuxi Innosonics Medical Technology CoLtdWuxiChina R&D Department of devices and processesJiashan Fudan InstituteJiaxingChina 

出 版 物：《International Journal of Smart and Nano Materials》 (国际智能和纳米材料杂志（英文）)

年 卷 期：2023年第14卷第4期

页      面：510-565页

核心收录：

学科分类：080904[工学-电磁场与微波技术] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 

基　　金：support by the National Natural Science Foundation of China(NSFC)[Grant No.11972325,12272342,12202398] the Natural Science Foundation of Zhejiang Province(LGF20A020001) 

主　　题：Flexible electronic devices failure mechanisms characterization methods 

摘      要：The rapid evolution of flexible electronic devices promises to revolutionize numerous fields by expanding the applications of smart ***,despite this vast potential,the reliability of these innovative devices currently falls short,especially in light of demanding operation environment and the intrinsic challenges associated with their fabrication *** heterogeneity in these processes and environments gives rise to unique failure modes throughout the devices *** significantly enhance the reliability of these devices and assure long-term performance,it is paramount to comprehend the underpinning failure mechanisms thoroughly,thereby,enabling,optimal design solutions.A myriad of investigative efforts have been dedicated to unravel these failure mechanisms,utilizing a spectrum of tools from analytical models,numerical methods,to advanced characterization *** review delves into the root causes of device failure,scrutinizing both the fabrication process and the operation ***,We subsequently address the failure mechanisms across four commonly observed modes:strength failure,fatigue failure,interfacial failure,and electrical failure,followed by an overview of targeted characterization methods associated with each *** with an outlook,we spotlight ongoing challenges and promising directions for future research in our pursuit of highly resilient flexible electronic devices.