Recent progress in printing flexible electronics: A review

作     者：BI Sheng GAO BuHan HAN Xu HE ZhengRan METTS Jacob JIANG ChengMing ASARE-YEBOAH Kyeiwaa 

作者机构：Key Laboratory for Precision and Non-traditional Machining Technology of the Ministry of EducationSchool of Mechanical EngineeringDalian University of TechnologyDalian 116024China Center for Materials for Information TechnologyThe University of AlabamaTuscaloosaAL 35487USA Department of Electrical and Computer EngineeringPenn State BehrendEriePA 16563USA 

出 版 物：《Science China(Technological Sciences)》 (中国科学（技术科学英文版）)

年 卷 期：2024年第67卷第8期

页      面：2363-2386页

核心收录：

学科分类：080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 0822[工学-轻工技术与工程] 

基　　金：UK Research and Innovation  UKRI  (104782) 

主　　题：flexible electronics printing process conductive ink flexible substrate 

摘      要：Miniaturization and flexibility are becoming the trend in the development of electronic products. These key features are driving new methods in the manufacturing of such products. Printed electronics technology is a novel additive manufacturing technique that uses active inks to print onto a diverse set of substrates, realizing large-area, low-cost, flexible and green manufacturing of electronic products. These advantageous properties make it extremely compatible with flexible electronics fabrication and extend as far as offering revolutionary methods in the production of flexible electronic devices. In this paper, the details of a printing process system are introduced, including the materials that can be employed as inks, common substrates, and the most recently reported printing strategies. An assessment of future setbacks and developments of printed flexible electronics is also presented.