Liquid metal compartmented by polyphenol-mediated nanointerfaces enables high-performance thermal management on electronic devices

作     者：Chaojun Zhang Yang Tang Tianyu Guo Yizhou Sang Ding Li Xiaoling Wang Orlando J.Rojas Junling Guo 

作者机构：BMI Center for Biomass Materials and NanointerfacesCollege of Biomass Science and EngineeringSichuan UniversityChengduSichuanthe People's Republic of China Bioproducts InstituteDepartments of Chemical and Biological EngineeringThe University of British ColumbiaVancouverBritish ColumbiaCanada Institute of Development StudiesSouthwestern University of Finance and EconomicsChengduSichuanthe People's Republic of China National Engineering Laboratory for Clean Technology of Leather ManufactureSichuan UniversityChengduSichuanthe People's Republic of China State Key Laboratory of Polymer Materials EngineeringSichuan UniversityChengduSichuanthe People's Republic of China 

出 版 物：《InfoMat》 (信息材料（英文）)

年 卷 期：2024年第6卷第1期

页      面：83-95页

核心收录：

学科分类：07[理学] 070205[理学-凝聚态物理] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0702[理学-物理学] 

基　　金：National Talents Program National Natural Science Foundation of China,Grant/Award Numbers:22108181,22178233 Talents Program of Sichuan Province Double First-Class University Plan of Sichuan University State Key Laboratory of Polymer Materials Engineering,Grant/Award Number:sklpme 2020-03-01 Sichuan Science and Technology Program,Grant/Award Number:2022YFN0070 The Sichuan Province Postdoctoral Special Funding 

主　　题：Electronic devices High thermal conductivity Liquid metals Natural polyphenols Thermal management 

摘      要：The exponentially increasing heat generation in electronic devices,induced by high power density and miniaturization,has become a dominant issue that affects carbon footprint,cost,performance,reliability,and *** metals(LMs)with high thermal conductivity are promising candidates for effective thermal management yet are facing pump-out and surface-spreading *** in the form of metallic particles can address these problems,but apparent alloying processes elevate the LM melting point,leading to severely deteriorated ***,we propose a facile and sustainable approach to address these challenges by using a biogenic supramolecular network as an effective diffusion barrier at copper particle-LM(EGaIn/Cu@TA)interfaces to achieve superior thermal *** supramolecular network promotes LM stability by reducing unfavorable alloying and fluidity *** EGaIn/Cu@TA exhibits a record-high metallic-mediated thermal conductivity(66.1 W m^(-1) K^(-1))and fluidic ***,mechanistic studies suggest the enhanced heat flow path after the incorporation of copper particles,generating heat dissipation suitable for computer central processing units,exceeding that of commercial *** results highlight the prospects of renewable macromolecules isolated from biomass for the rational design of nanointerfaces based on metallic particles and LM,paving a new and sustainable avenue for high-performance thermal management.