IGBT Temperature Field Monitoring Based on Reduced-order Model
作者机构：School of Electrical Engineering&AutomationHarbin Institute of TechnologyHarbin 150001China IEEE Flight control departmentXi'an Flight Automatic Control Research InstituteXi'an 710076China
出 版 物：《CES Transactions on Electrical Machines and Systems》 (中国电工技术学会电机与系统学报（英文）)
年 卷 期：2023年第7卷第2期
页 面：129-136页
核心收录：
学科分类：08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0714[理学-统计学（可授理学、经济学学位）] 0701[理学-数学]
基 金：supported in part by Heilongjiang Provincial Natural Science Foundation of China under Project TD2021E004 in part by Ningbo Science and Technology Bureau under S&T Innovation 2025 Major Special Programme with project code 2019B10071。
主 题：IGBT Junction temperature Proper orthogonal decomposition Reduced-order model
摘 要：With the rapid development of the world economy,IGBT has been widely used in motor drive and electric energy conversion.In order to timely detect the fatigue damage of IGBT,it is necessary to monitor the junction temperature of IGBT.In order to realize the fast calculation of IGBT junction temperature,a finite element method of IGBT temperature field reduction is proposed in this paper.Firstly,the finite element calculation process of IGBT temperature field is introduced and the linear equations of finite element calculation of temperature field are derived.Temperature field data of different working conditions are obtained by finite element simulation to form the sample space.Then the covariance matrix of the sample space is constructed,whose proper orthogonal decomposition and modal extraction are carried out.Reasonable basis vector space is selected to complete the low dimensional expression of temperature vector inside and outside the sample space.Finally,the reduced-order model of temperature field finite element is obtained and solved.The results of the reduced order model are compared with those of the finite element method,and the performance of the reduced-order model is evaluated from two aspects of accuracy and rapidity.
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