Effect of constraint on crack propagation behavior in BGA soldered joints

作     者：王莉 王国忠 方洪渊 钱乙余 

作者机构：中科院 Diamler Chrysler SIM 技术有限公司 上海 200050 哈尔滨工业大学 现代焊接生产技术国家重点实验室 黑龙江 哈尔滨 150001 

出 版 物：《Transactions of Nonferrous Metals Society of China》 (中国有色金属学报(英文版))

年 卷 期：2001年第11卷第6期

页      面：895-899页

核心收录：

学科分类：080503[工学-材料加工工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 080201[工学-机械制造及其自动化] 

基　　金：Project 180 5supportedby 2 11projectFundofHarbinInstituteofTechnology 

主　　题：constraint crack behavior joints 

摘      要：The effects of stress triaxiality on crack propagation behavior in the BGA soldered joint were analyzed using FEM method. The computation results verified that stress triaxiality factor has an important effect on crack growth behavior. Crack growth rate increased with increasing stress triaxiality at the near tip region, which is caused by increasing crack lengths or decreasing solder joint heights. Solder joint deformation is subjected to constraint effect provided by its surrounding rigid ceramic substrate, the constraint can be scaled by stress triaxiality near crack tip region. Therefore, it can be concluded that crack growth rate increased when the constraint effect increases.