Highly conformable chip-in-foil implants for neural applications

作     者：Thomas Stieglitz Calogero Gueli Julien Martens Niklas Floto Max Eickenscheidt Markus Sporer Maurits Ortmanns 

作者机构：Laboratory for Biomedical MicrotechnologyDepartment of Microsystems Engineering-IMTEKUniversity of FreiburgD-79110 FreiburgGermany BrainLinks-BrainTools//IMBITUniversity of FreiburgD-79110 FreiburgGermany Institute of MicroelectronicsUniversity of UlmD-89081 UlmGermany 

出 版 物：《微系统与纳米工程(英文)》 (Microsystems & Nanoengineering)

年 卷 期：2023年第9卷第3期

页      面：245-257页

核心收录：

学科分类：12[管理学] 1201[管理学-管理科学与工程(可授管理学、工学学位)] 081104[工学-模式识别与智能系统] 08[工学] 0835[工学-软件工程] 0811[工学-控制科学与工程] 0812[工学-计算机科学与技术（可授工学、理学学位）] 

基　　金：The authors thank the colleagues at IMTEK and UUlm for their technical support.This work was funded by the German Research Foundation(DFG,grant no.401023906 and OR 245/15-1) is part of BrainLinks-BrainTools,which was funded by the German Research Foundation(DFG,grant no.EXC 1086)and is currently funded by the Federal Ministry of Economics,Science and Arts of Baden Württemberg within the sustainability program for projects of the excellence initiative 

主　　题：neural positions shape 

摘      要：Demands for neural interfaces around functionality,high spatial resolution,and longevity have recently *** requirements can be met with sophisticated silicon-based integrated *** miniaturized dice in flexible polymer substrates significantly improves their adaptation to the mechanical environment in the body,thus improving the systems’structural biocompatibility and ability to cover larger areas of the *** work addresses the main challenges in developing a hybrid chip-in-foil neural *** considered(1)the mechanical compliance to the recipient tissue that allows a long-term application and(2)the suitable design that allows the implant’s scaling and modular adaptation of chip *** element model studies were performed to identify design rules regarding die geometry,interconnect routing,and positions for contact pads on *** edge fillets in the die base shape proved an effective measure to improve die-substrate integrity and increase the area available for contact ***,routing of interconnects in the immediate vicinity of die corners should be avoided,as the substrate in these areas is prone to mechanical stress *** pads on dice should be placed with a clearance from the die rim to avoid delamination when the implant conforms to a curvilinear body.A microfabrication process was developed to transfer,align,and electrically interconnect multiple dice into conformable polyimide-based *** process enabled arbitrary die shape and size over independent target positions on the conformable substrate based on the die position on the fabrication wafer.