Experimental and Numerical Analysis of the Influence ofMicrochannel Size and Structure on Boiling Heat Transfer

作     者：Ningbo Guo Xianming Gao Duanling Li Jixing Zhang Penghui Yin Mengyi Hua 

作者机构：School of Mechanical and Electrical EngineeringShaanxi University of Science and TechnologyXi’an710021China 

出 版 物：《Computer Modeling in Engineering & Sciences》 (工程与科学中的计算机建模（英文）)

年 卷 期：2023年第136卷第9期

页      面：3061-3082页

核心收录：

学科分类：08[工学] 080103[工学-流体力学] 0801[工学-力学（可授工学、理学学位）] 0812[工学-计算机科学与技术（可授工学、理学学位）] 

基　　金：supported by the National Natural Science Foundation of China Youth Program(Grant No.51905328). 

主　　题：Microchannel boiling heat transfer bubble numerical simulation visual experiment 

摘      要：Computational fluid dynamics was used and a numerical simulation analysis of boiling heat transfer in microchannels with three depths and three cross-sectional profiles was conducted.The heat transfer coefficient and bubble generation process of three microchannel structures with a width of 80μm and a depth of 40,60,and 80μm were compared during the boiling process,and the factors influencing bubble generation were studied.A visual test bench was built,and test substrates of different sizes were prepared using a micro-nano laser.During the test,the behavior characteristics of the bubbles on the boiling surface and the temperature change of the heated wall were collected with a high-speed camera and a temperature sensor.It was found that the microchannel with a depth of 80μm had the largest heat transfer coefficient and shortest bubble growth period,the rectangular channel had a larger peak heat transfer coefficient and a lower frequency of bubble occurrence,while the V-shaped channel had the shortest growth period,i.e.,the highest frequency of bubble occurrence,but its heat transfer coefficient was smaller than that of the rectangular channel.