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“Volume-point” heat conduction constructal optimization based on entransy dissipation rate minimization with three-dimensional cylindrical element and rectangular and triangular elements on microscale and nanoscale

"Volume-point" heat conduction constructal optimization based on entransy dissipation rate minimization with three-dimensional cylindrical element and rectangular and triangular elements on microscale and nanoscale

作     者:FENG HuiJun CHEN LinGen SUN FengRui 

作者机构:College of Naval Architecture and PowerNaval University of EngineeringWuhan 430033China 

出 版 物:《Science China(Technological Sciences)》 (中国科学(技术科学英文版))

年 卷 期:2012年第55卷第3期

页      面:779-794页

核心收录:

学科分类:0810[工学-信息与通信工程] 080701[工学-工程热物理] 07[理学] 08[工学] 070601[理学-气象学] 0807[工学-动力工程及工程热物理] 0805[工学-材料科学与工程(可授工学、理学学位)] 0706[理学-大气科学] 0702[理学-物理学] 0812[工学-计算机科学与技术(可授工学、理学学位)] 

基  金:supported by the National Natural Science Foundation of China (Grant No. 51176203) the Natural Science Foundation of Naval University of Engineering (Grant No. HGDYDJJ10011) the Natural Science Foundation for Youngsters of Naval University of Engineering (Grant No. HGDQNJJ10017) 

主  题:构形优化 耗散率 三角形 纳米级 长方形 元素 微型 圆柱 

摘      要:Based on constructal theory,the constructs of three volume-point heat conduction models with three-dimensional cylindrical element and rectangular and triangular elements on microscale and nanoscale are optimized by taking minimum entransy dissipation rate as optimization *** optimal constructs of the three volume-point heat conduction models with minimum dimensionless equivalent thermal resistance are *** results show that the optimal constructs of the three-dimensional cylindrical assembly based on the minimizations of dimensionless equivalent thermal resistance and dimensionless maximum thermal resistance are different,which is obviously different from the comparison between those of the corresponding two-dimensional rectangular assembly based on the minimizations of these two *** optimal constructs based on rectangular and triangular elements on microscale and nanoscale when the size effect takes effect are obviously different from those when the size effect does not take *** the thermal current density in the high conductivity channel of the rectangular and triangular second order assemblies are not linear with the length,the optimal constructs of these assemblies based on the minimization of entransy dissipation rate are different from those based on the minimization of maximum temperature *** dimensionless equivalent thermal resistance defined based on entransy dissipation rate reflects the average heat transfer performance of the *** studies on volume-point heat conduction constructal problems at three-dimensional conditions and microscale and nanoscale by taking minimum entransy dissipation rate as optimization objective extend the application range of the entransy dissipation extremum principle.

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