Solid state interfacial reactions in electrodeposited Ni/Sn couples

作     者：Wen-ming Tang An-qiang He Qi Liu Douglas-G. Ivey 

作者机构：Department of Materials Science and Engineering Hefei University of Technology Hefei 230009 China Department of Chemical and Materials Engineering University of Alberta Edmonton T6G 2G6 Canada 

出 版 物：《International Journal of Minerals,Metallurgy and Materials》 (矿物冶金与材料学报（英文版）)

年 卷 期：2010年第17卷第4期

页      面：459-463页

核心收录：

学科分类：07[理学] 070205[理学-凝聚态物理] 08[工学] 080501[工学-材料物理与化学] 080402[工学-测试计量技术及仪器] 0804[工学-仪器科学与技术] 0805[工学-材料科学与工程（可授工学、理学学位）] 0703[理学-化学] 0702[理学-物理学] 

基　　金：the Natural Sciences and Engineering Research Council(NSERC) of Canada and Micralyne Inc.for providing the research fund and Si substrates for electroplating(Micralyne) 

主　　题：electrodeposition solid state reaction diffusion microstructure kinetics 

摘      要：Ni/Sn couples, prepared by sequentially electroplating Ni layers and Sn layers on metallized Si wafers, were employed to study the microstructures and growth kinetics of Ni-Sn intermediate phases, when the Ni/Sn couples were aged at room temperature or armealed at temperatures from 150 to 225℃ for various times. The results show that the NiSn phase and Ni3Sn4 phase are formed, respectively, in the aged couples and annealed couples. The Ni3Sn4 layer is continuously distributed between the Ni and Sn sides in the annealed Ni/Sn couples. The Ni3Sn4 growth follows parabolic growth kinetics with an apparent activation energy of 39.0 kJ/mol.