16-channel photonic–electric co-designed silicon transmitter with ultra-low power consumption

作     者：JINGBO SHI MING JIN TAO YANG HAOWEN SHU FENGHE YANG HAN LIU YUANSHENG TAO JIANGRUI DENG RUIXUAN CHEN CHANGHAO HAN NAN QI XINGJUN WANG 

作者机构：State Key Laboratory of Advanced Optical Communication Systems and NetworksSchool of ElectronicsPeking UniversityBeijing 100871China College of EngineeringPeking UniversityBeijing 100871China Peking University Yangtze Delta Institute of OptoelectronicsNantong 226010China State Key Laboratory of Superlattices and MicrostructuresInstitute of SemiconductorsChinese Academy of SciencesBeijing 100083China Center of Material Science and Optoelectronics EngineeringUniversity of Chinese Academy of SciencesBeijing 100049China Frontier Science Center for Nano-optoelectronicsPeking UniversityBeijing 100871China 

出 版 物：《Photonics Research》 (光子学研究（英文版）)

年 卷 期：2023年第11卷第2期

页      面：143-149页

核心收录：

学科分类：080903[工学-微电子学与固体电子学] 070207[理学-光学] 07[理学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 0702[理学-物理学] 

基　　金：National Key Research and Development Program of China(2021YFB0301000 2020YFB2206100 2022YFB2803700) 

主　　题：channel power return 

摘      要：A hybrid integrated 16-channel silicon transmitter based on co-designed photonic integrated circuits(PICs) and electrical chiplets is demonstrated. The driver in the 65 nm CMOS process employs the combination of a distributed architecture, two-tap feedforward equalization(FFE), and a push–pull output stage, exhibiting an estimated differential output swing of 4.0V_(pp). The rms jitter of 2.0 ps is achieved at 50 Gb/s under nonreturnto-zero on–off keying(NRZ-OOK) modulation. The PICs are fabricated on a standard silicon-on-insulator platform and consist of 16 parallel silicon dual-drive Mach–Zehnder modulators on a single chip. The chip-on-board co-packaged Si transmitter is constituted by the multichannel chiplets without any off-chip bias control, which significantly simplifies the system complexity. Experimentally, the open and clear optical eye diagrams of selected channels up to 50 Gb/s OOK with extinction ratios exceeding 3 dB are obtained without any digital signal processing. The power consumption of the Si transmitter with a high integration density featuring a throughput up to 800 Gb/s is only 5.35 p J/bit, indicating a great potential for massively parallel terabit-scale optical interconnects for future hyperscale data centers and high-performance computing systems.