Recent Advances and Challenges Toward Application of Fibers and Textiles in Integrated Photovoltaic Energy Storage Devices

作     者：Amjid Rafique Isabel Ferreira Ghulam Abbas Ana Catarina Baptista Amjid Rafique;Isabel Ferreira;Ghulam Abbas;Ana Catarina Baptista

作者机构：CENIMAT|I3NDepartment of Materials ScienceSchool of Science and TechnologyNOVA University LisbonCampus de Caparica2829‑516 CaparicaPortugal 

出 版 物：《Nano-Micro Letters》 (纳微快报（英文版）)

年 卷 期：2023年第15卷第3期

页      面：190-247页

核心收录：

学科分类：0821[工学-纺织科学与工程] 080801[工学-电机与电器] 0808[工学-电气工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0812[工学-计算机科学与技术（可授工学、理学学位）] 

基　　金：National Funds through FCT–Portuguese Foundation for Science and Technology under the projects PTDC/CTM-CTM/1571/2020(All-Fi BRE),LA/P/0037/2020,UIDP/50025/2020 and UIDB/50025/2020(CENIMAT/I3N) by ERC-Co G-2014,CapTherPV,647596。 

主　　题：Flexible electronics Electronic textiles Energy harvesting Supercapacitors Photovoltaic devices 

摘      要：Flexible microelectronic devices have seen an increasing trend toward development of miniaturized,portable,and integrated devices as wearable electronics which have the requirement for being light weight,small in dimension,and suppleness.Traditional three-dimensional(3D)and two-dimensional(2D)electronics gadgets fail to effectively comply with these necessities owing to their stiffness and large weights.Investigations have come up with a new family of one-dimensional(1D)flexible and fiber-based electronic devices(FBEDs)comprising power storage,energy-scavenging,implantable sensing,and flexible displays gadgets.However,development and manufacturing are still a challenge owing to their small radius,flexibility,low weight,weave ability and integration in textile electronics.This paper will provide a detailed review on the importance of substrates in electronic devices,intrinsic property requirements,fabrication classification and applications in energy harvesting,energy storage and other flexible electronic devices.Fiber-and textile-based electronic devices for bulk/scalable fabrications,encapsulation,and testing are reviewed and presented future research ideas to enhance the commercialization of these fiber-based electronics devices.