Optimized strength and conductivity of multi-scale copper alloy/metallic glass composites tuned by a one-step spark plasma sintering(SPS)process

作     者：Weizong Bao Jie Chen Guoqiang Xie Weizong Baoa;Jie Chena;Guoqiang Xie

作者机构：School of Materials Science and EngineeringHarbin Institute of Technology(Shenzhen)Shenzhen 518055China State Key Laboratory of Advanced Welding and JoiningHarbin Institute of TechnologyHarbin 150001China 

出 版 物：《Journal of Materials Science & Technology》 (材料科学技术（英文版）)

年 卷 期：2022年第128卷第33期

页      面：22-30页

核心收录：

学科分类：08[工学] 0806[工学-冶金工程] 0805[工学-材料科学与工程（可授工学、理学学位）] 

基　　金：financially supported by the Shenzhen Knowledge Innovation Plan-Fundamental Research(Discipline Distribution)(No.JCYJ20180507184623297) the National Natural Science Foundation of China(No.51871077) the Guangdong Basic and Applied Basic Research Foundation(No.2021A1515012626) the Shenzhen Science and Technology Plan-Technology Innovation(No.KQJSCX20180328165656256) the Development and Reform Commission of Shenzhen Municipality-Shenzhen R&D Center for Albased Hydrogen Hydrolysis Materials(No.ZX20190229) the Startup Foundation from Shenzhen and Startup Foundation from Harbin Institute of Technology(Shenzhen)。 

主　　题：CuZrAl metallic glass Spark plasma sintering Mechanical properties Electrical performance 

摘      要：A superiority in interfacial bonding is favorable to fabricate high-strength conductive composites for electrical contact applications.In the present work,high strength and high conductivity multi-scale metallic glass composites(including micron-scale Cu Zr Al metallic glass reinforcement,hundred-nanometer-scale Cu Cr Zr crystalline grain matrix,and nano-scale precipitated phase)were fabricated by a one-step spark plasma sintering(SPS).The strength and conductivity of the bulk copper matrix metallic glass composites(BCMGCs)were enhanced simultaneously with the increase in the sintering pressure of the SPS.The excellent performance is attributed to the improved interfacial bonding between the metallic glass reinforcement and the copper alloy matrix due to the high pressure assisted by temperature and pulsed current.In particular,the precipitation of nanoprecipitates at the interface further reduces the interfacial resistance and improves the mechanical properties of the composites.This work broadens the horizon for the selection and optimization of reinforcements and manufacturing processes for high-performance electrical contact materials(ECMs).