An investigation on application potentiality of microstructure heat sinks with different flow topological morphology

作     者：YAO XiaoLe SHI QianLei LIU Qian QIN Le JU Xing XU Chao 

作者机构：Key Laboratory of Power Station Energy Transfer Conversion and System of MOENorth China Electric Power UniversityBeijing 102206China 

出 版 物：《Science China(Technological Sciences)》 (中国科学（技术科学英文版）)

年 卷 期：2022年第65卷第12期

页      面：2895-2909页

核心收录：

学科分类：080903[工学-微电子学与固体电子学] 080702[工学-热能工程] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 0807[工学-动力工程及工程热物理] 

基　　金：supported by the National Natural Science Foundation of China(Grant No.51876062) the Interdisciplinary Innovation Program of North China Electric Power University 

主　　题：heat sink topology manifold microchannel micro-pin-fin high heat flux 

摘      要：Microstructure heat sinks have great potential for high heat flux *** this paper,we compared microchannel(MC),micro-pin-fin(MPF),manifold microchannel(MMC),and manifold micro-pin-fin(MMPF)heat sinks to figure out the pros and *** flow and manifold unit models are used to study thermal and hydrodynamic *** heat sinks with different channel/fin sizes,manifold numbers,and porosities are discussed according to the pressure drop,temperature,thermal resistance,and coefficient of *** show that MMC and MMPF heat sinks are superior to MC and MPF heat sinks,and there are also differences between MMC and MMPF heat ***,the MMPF heat sink has lower maximum temperature,temperature non-uniformity,and total thermal resistance R_(tot).In contrast,the MMC heat sink has a lower pressure drop and higher *** the MMPF heat sink,at the nozzle width of 6.75μm and the MPF width of 70.71μm(porosity=0.167),it achieves the lowest total thermal resistance of R_(tot)=2.97×10^(-6)K m^(2)/*** 10^(3)W/cm^(2)heat flux,the maximum surface temperature rise is 29.74 K,and the maximum temperature difference of the heating surface is 3.15 *** research initially provides a clear reference on the selection of single-phase cooling microstructures for ultra-high heat flux dissipation.