Optical wafer defect inspection at the 10 nm technology node and beyond

作     者：Jinlong Zhu Jiamin Liu Tianlai Xu Shuai Yuan Zexu Zhang Hao Jiang Honggang Gu Renjie Zhou Shiyuan Liu Jinlong Zhu;Jiamin Liu;Tianlai Xu;Shuai Yuan;Zexu Zhang;Hao Jiang;Honggang Gu;Renjie Zhou;Shiyuan Liu

作者机构：State Key Laboratory of Digital Manufacturing Equipment and TechnologyHuazhong University of Science and TechnologyWuhan 430074People’s Republic of China School of AstronauticsHarbin Institute of TechnologyHarbin 150001People’s Republic of China Department of Biomedical EngineeringThe Chinese University of Hong KongShatinNew TerritoriesHong Kong SARPeople’s Republic of China 

出 版 物：《International Journal of Extreme Manufacturing》 (极端制造（英文）)

年 卷 期：2022年第4卷第3期

页      面：1-24页

核心收录：

学科分类：080903[工学-微电子学与固体电子学] 070207[理学-光学] 0809[工学-电子科学与技术（可授工学、理学学位）] 07[理学] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 0702[理学-物理学] 

基　　金：funded by the National Natural Science Foundation of China(Grant Nos.52175509 and 52130504) the National Key Research and Development Program of China(2017YFF0204705) the Key Research and Development Plan of Hubei Province(2021BAA013) the National Science and Technology Major Project(2017ZX02101006-004)。 

主　　题：optical defect inspection microscopy nanophotonics integrated circuits deep learning 

摘      要：The growing demand for electronic devices, smart devices, and the Internet of Things constitutes the primary driving force for marching down the path of decreased critical dimension and increased circuit intricacy of integrated circuits. However, as sub-10 nm high-volume manufacturing is becoming the mainstream, there is greater awareness that defects introduced by original equipment manufacturer components impact yield and manufacturing costs. The identification, positioning, and classification of these defects, including random particles and systematic defects, are becoming more and more challenging at the 10 nm node and beyond.Very recently, the combination of conventional optical defect inspection with emerging techniques such as nanophotonics, optical vortices, computational imaging, quantitative phase imaging, and deep learning is giving the field a new possibility. Hence, it is extremely necessary to make a thorough review for disclosing new perspectives and exciting trends, on the foundation of former great reviews in the field of defect inspection methods. In this article, we give a comprehensive review of the emerging topics in the past decade with a focus on three specific areas:(a) the defect detectability evaluation,(b) the diverse optical inspection systems,and(c) the post-processing algorithms. We hope, this work can be of importance to both new entrants in the field and people who are seeking to use it in interdisciplinary work.