Laser projection proximity transfer for deterministic assembly of microchip arrays at scale

作     者：HU JinLong CHEN FuRong BIAN Jing SUN NingNing WANG KaiXin LING Hong YU HaiYang GAI MengXin XU LiZhi HUANG YongAn 

作者机构：State Key Laboratory of Digital Manufacturing Equipment and TechnologyHuazhong University of Science and TechnologyWuhan 430074China Flexible Electronics Research CenterHuazhong University of Science and TechnologyWuhan 430074China College of Electronic and Optical Engineering&College of MicroelectronicsNanjing University of Posts and TelecommunicationsNanjing 210023China Department of Mechanical EngineeringThe University of Hong KongHong Kong SAR 999077China 

出 版 物：《Science China(Technological Sciences)》 (中国科学（技术科学英文版）)

年 卷 期：2022年第65卷第9期

页      面：2205-2214页

核心收录：

学科分类：080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 

基　　金：supported by the National Natural Science Foundation of China(Grant Nos.51925503,52188102,and 52105576) the Natural Science Foundation of Hubei Province of China(Grant No.2020CFA028)。 

主　　题：microtransfer printing micro LED display laser lift-off interfacial adhesion 

摘      要：Deterministic assembly techniques that enable programmatic and massively parallel integration of chips are essential for the development of novel electronic systems such as micro LED displays.However,large-area integration of ultrathin micro-chips with high yield and transfer accuracy remains a great challenge due to the difficulties in selective transfer,adhesion switchability,and transfer deviation.Here,a“laser projection proximity transfer(Laser PPT)technique is presented for the deterministic assembly of microchip arrays at scale.One of the remarkable features is that the transfer status between the chip and the receiver substrate evolves from the original non-contact mode to contact mode for high-precision transfer,which overcomes the strict requirements of the flatness of stamp and substrate in contact-style transfer,and flight deviation of microchip array in noncontact-style transfer.Another feature is the rapid modulation of interfacial adhesion for reliable transfer via the use of thermally expandable microspheres to form microstructures and combining with a laser-induced blister.The adhesion regulation range is over 20 times without any damage to chip arrays.The results show that the transfer accuracy has been improved substantially with a minimum relative error of~0.5%.Combined with a laser beam projection system,demonstrations of Laser PPT for selective assembly of fragile objects onto challenging non-adhesive/cured surfaces in batch illustrate its potential in the highprecision integration of microscale chips at scale.