Highly impermeable and flexible silica encapsulation films synthesized by sol-gel process
作者机构：School of Materials Science and EngineeringUniversity of UlsanTechno saneop-ro 55beon-gil 12Ulsan 44776Republic of Korea Department of Materials Science and EngineeringUlsan National Institute of Science and Technology(UNIST)UNIST-gil 50Ulsan 44919Republic of Korea Department of PhysicsKorea Advanced Institute of Science and Technology(KAIST)Daehak-ro 291Deajeon 34141Republic of Korea Graduate School of Semiconductor Materials and DevicesUlsan National Institute of Science and Technology(UNIST)UNIST-gil 50Ulsan 44919Republic of Korea
出 版 物：《Nano Research》 (纳米研究（英文版）)
年 卷 期：2022年第15卷第8期
页 面：7476-7483页
核心收录：
学科分类：081702[工学-化学工艺] 08[工学] 0817[工学-化学工程与技术]
基 金：Basic Science Research Program through the National Research Foundation of Korea(NRF)funded by the Ministry of Education(No.2019R1I1A3A01054545) National Research Foundation of Korea(NRF)grant funded by the Ministry of Science and ICT(MSIT)(Nos.2020M3H4A1A02084911 and 2019R1A2C1009025)
主 题：silica thin film sol-gel flexible encapsulation mechanical reliability flexible organic solar cell
摘 要：Silica thin films synthesized sol–gel process are proposed as flexible encapsulation materials.A sol–gel process provides a dense and stable amorphous silica structure,yielding an extremely high elastic deformation limit of 4.9%and extremely low water vapor transmission rate(WVTR)of 2.90×10^(−4)g/(m^(2)∙day)at 60℃and relative humidity of 85%.The WVTR is not degraded by cyclic bending deformations for the bending radius corresponding to a tensile strain of 3.3%in the silica encapsulation film,implying that the silica thin film is robust against the formation of pinhole-type defects by cyclic bending *** organic solar cells encapsulated with the silica films operate without degradation in power conversion efficiency for 50,000 bending cycles for a bending radius of 6 mm.
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