Novel interface regulation of Sn1.0Ag0.5Cu composite solders reinforced with modified ZrO_(2):Microstructure and mechanical properties

作     者：Fupeng Huo Zhi Jin Duy Le Han Jiahui Li Keke Zhang Hiroshi Nishikawa Fupeng Huo;Zhi Jin;Duy Le Han;Jiahui Li;Keke Zhang;Hiroshi Nishikawa

作者机构：Joining and Welding Research InstituteOsaka UniversityIbarakiOsaka 565-0047Japan Graduate School of EngineeringOsaka UniversitySuitaOsaka 565-0871Japan School of Materials Science and EngineeringHenan University of Science and TechnologyLuoyang 471023China Department of Welding Engineering and Metals TechnologySchool of Mechanical EngineeringHanoi University of Science and TechnologyNo.1 Dai Co VietHai Ba TrungHanoiViet Nam 

出 版 物：《Journal of Materials Science & Technology》 (材料科学技术（英文版）)

年 卷 期：2022年第125卷第30期

页      面：157-170页

核心收录：

学科分类：08[工学] 0806[工学-冶金工程] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 080201[工学-机械制造及其自动化] 

基　　金：supported by the China Scholarship Council(No.202008050209)。 

主　　题：SnAgCu composite solder ZrO_(2)nanoparticles Refinement mechanism Surface modification Interface Reinforcements 

摘      要：With the trends of miniaturization and high density of electronic packaging,there has been an urgent demand to open up lead-free solders with high strength and ductility.In this study,a ZrO_(2)-reinforced Sn1.0Ag0.5Cu composite solder was designed.First,surface modification on ZrO_(2) was conducted with ball milling-pyrolysis method.Subsequently,NiO modified ZrO_(2)(NiO/ZrO_(2))was added to the solder matrix with ultrasonic stirring.The morphology and interface of NiO/ZrO_(2) were discussed.Moreover,the microstructure,interface and mechanical properties of the composite solders were systematically studied.The results showed that NiO nanoparticles were evenly adhered to the ZrO_(2) surface,and the interface relationship between them was semi-coherent and coherent.Further,an appropriate addition of NiO/ZrO_(2) could refine the microstructure of composite solders.The refinement mechanism was systematically investigated.Besides,a micro-mechanical lock and non-micropored clean interface was formed between NiO/ZrO_(2) and the solder matrix.The Sn/NiO/ZrO_(2) interface system based on mutual solid solution was ingeniously designed.The ultimate tensile strength and elongation were increased synergistically,and the fracture mechanism transformed from a ductile−brittle mixed fracture mode to a ductile fracture mode.Therefore,a lead-free solder with high strength and ductility was obtained.