Quantitative mechanisms behind the high strength and electrical conductivity of Cu-Te alloy manufactured by continuous extrusion

作     者：Qianqian Fu Bing Li Minqiang Gao Ying Fu Rongzhou Yu Changfeng Wang Renguo Guan Qianqian Fu;Bing Li;Minqiang Gao;Ying Fu;Rongzhou Yu;Changfeng Wang;Renguo Guan

作者机构：Liaoning Key Laboratory of Near-Net Shape Forming of Light Metal MaterialsDalian Jiaotong UniversityDalian 116028China Shanxi Datong UniversityDatong 037009China Engineering Research Center of Continuous ExtrusionMinistry of EducationDalian Jiaotong UniversityDalian 116028China Songshan Lake Materials LaboratoryDongguan 523808China 

出 版 物：《Journal of Materials Science & Technology》 (材料科学技术（英文版）)

年 卷 期：2022年第121卷第26期

页      面：9-18页

核心收录：

学科分类：080503[工学-材料加工工程] 0806[工学-冶金工程] 0817[工学-化学工程与技术] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0703[理学-化学] 0802[工学-机械工程] 0702[理学-物理学] 0801[工学-力学（可授工学、理学学位）] 080201[工学-机械制造及其自动化] 

基　　金：the National Key Research and Development Program of China(No.2018YFB2001800) Key Scientific and Technological Project in Liaoning Province of China in 2021(No.2021JH/10400080) Dalian High Level Talent Innovation Support Program in Liaoning Province of China in 2021(No.2021RD06) 

主　　题：Cu-Te alloy Continuous extrusion Microstructure Electrical conductivity Yield strength 

摘      要：The microstructure,mechanical performance,and electrical conductivity of Cu-Te alloy fabricated by continuous extrusion were quantitatively *** results demonstrate that the grain size of the Cu-Te alloy is refined significantly by incomplete dynamic *** Cu2Te phase stimulates recrystallization and inhibits subgrain *** extrusion,the tensile strength increases from217.8±4.8 MPa to 242.5±3.7 MPa,the yield strength increases from 65.1±3.5 MPa to 104.3±3.8 MPa,and the yield to tensile strength ratio is improved from 0.293±0.015 to 0.43±.0.091,while the electrical conductivity of room temperature decreases from 95.8±0.38%International Annealed Cu Standard(IACS)to 94.0%±0.32%*** quantitative analysis shows that the increment caused by dislocation strengthening and boundary strengthening account for 84.6%of the yield strength of the extruded Cu-Te alloy and the electrical resistivity induced by grain boundaries and dislocations accounts for 1.6%of the electrical resistivity of the extruded Cu-Te *** and boundaries contribute greatly to the increase of yield strength,but less to the increase of electrical resistivity.