Preliminary Investigation of Copper Joints Soldered with Sn58Bi

作     者：Amares Singh Teow Sinn Khai Rajkumar Durairaj Amer Ahmed Qassem Saleh Amares Singh;Teow Sinn Khai;Rajkumar Durairaj;Amer Ahmed Qassem Saleh

作者机构：Center for Advanced Materials Research and Manufacturing ProcessesSEGi UniversityPetaling Jaya 47810SelangorMalaysia Lee Kong Chian Faculty of Engineering and ScienceUniversity Tunku Abdul RahmanKajang 43000SelangorMalaysia 

出 版 物：《Journal of Harbin Institute of Technology(New Series)》 (哈尔滨工业大学学报（英文版）)

年 卷 期：2022年第29卷第1期

页      面：57-63页

学科分类：080503[工学-材料加工工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0802[工学-机械工程] 080201[工学-机械制造及其自动化] 

主　　题：SnBi solder low temperature shear strength contact angle 

摘      要：In recent years,intensive studies have been carried out to find an alternative for Tin(Sn)⁃Lead(Pb)solder alloys with increasing demand over lower temperature solder alloys in current electronic packaging *** temperature operational solder alloys seem to produce drawback to other components on the printed circuit board(PCB).Low melting temperature Sn58Bi substrate as a potential replacement was investigated in this paper based on the melting properties,wettability,and shear *** Sn58Bi was soldered at a temperature below 200℃on the Cu substrate,and the shear strength and contact angle were calculated.A peak temperature(melting temperature,T_(M))of 144.83℃was *** lap joint method was performed at a strain rate of 0.1 mm/min and an average shear strength of 23.4 MPa was found from three *** contact angle(wettability)was calculated to study the solder joint behaviour at reflow temperature of 170℃.The contact angle of the Sn58Bi was found to be 32.4°and considered to be desired value since the angle is less than 50°.The low temperature soldering provides a preliminary result to allow further application on the real PCB.