Laser Erasing and Rewriting of Flexible Copper Circuits

作     者：Xingwen Zhou Wei Guo Peng Peng Xingwen Zhou;Wei Guo;Peng Peng

作者机构：School of Mechanical Engineering and AutomationBeihang UniversityBeijing 100191People’s Republic of China Department of Mechanical and Mechatronics EngineeringCentre for Advanced Materials JoiningUniversity of WaterlooWaterlooON N2L 3G1Canada 

出 版 物：《Nano-Micro Letters》 (纳微快报（英文版）)

年 卷 期：2021年第13卷第11期

页      面：409-420页

核心收录：

学科分类：0808[工学-电气工程] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 0817[工学-化学工程与技术] 0805[工学-材料科学与工程（可授工学、理学学位）] 0803[工学-光学工程] 0702[理学-物理学] 

基　　金：The authors acknowledge financial support from the National Key R&D Program of China(2017YFB1104900) the National Natural Science Foundation of China(51975033) the Beijing Natural Science Foundation(3192020) P.P.acknowledges support from NSERC discovery grant.X.Z.thanks Z.H.(College of Chemistry and Materials Science,Northwest University)for his support on XPS testing and analyzing. 

主　　题：Laser writing Laser erasing Copper electrodes Electronic repairing Flexible electronics 

摘      要：Integrating construction and reconstruction of highly conductive structures into one process is of great interest in developing and manufacturing of electronics,but it is quite challenging because these two involve contradictive additive and subtractive processes.In this work,we report an all-laser mask-less processing technology that integrates manufacturing,modifying,and restoring of highly conductive Cu structures.By traveling a focused laser,the Cu patterns can be fabricated on the flexible substrate,while these as-written patterns can be selectively erased by changing the laser to a defocused state.Subsequently,the fresh patterns with identical conductivity and stability can be rewritten by repeating the writing step.Further,this erasing–rewriting process is also capable of repairing failure patterns,such as oxidation and cracking.Owing to the high controllability of this writing–erasing–rewriting process and its excellent reproducibility for conductive structures,it opens a new avenue for rapid healing and prototyping of electronics.