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Study on Camellia Oleifera Protein based Wood Adhesive by Epoxy Resin and Its Crosslinking Mechanism

Study on Camellia Oleifera Protein based Wood Adhesive by Epoxy Resin and Its Crosslinking Mechanism

作     者:CHEN Sicheng LIANG Jiankun ZHANG Bengang WU Zhigang LEI Hong LI Lifen YANG Shoulu 陈思成;LIANG Jiankun;ZHANG Bengang;吴志刚;雷洪;LI Lifen;YANG Shoulu

作者机构:College of ForestryGuizhou UniversityGuiyang 550025China School of Architectural EngineeringKaili UniversityQiandongnan 556011China Yunnan Provincial Key Laboratory of Wood Adhesives and Glued ProductsSouthwest Forestry UniversityKunming 650224China Guizhou Academy of ForestryGuiyang 550005China 

出 版 物:《Journal of Wuhan University of Technology(Materials Science)》 (武汉理工大学学报(材料科学英文版))

年 卷 期:2021年第36卷第4期

页      面:607-613页

核心收录:

学科分类:081702[工学-化学工艺] 08[工学] 0817[工学-化学工程与技术] 0805[工学-材料科学与工程(可授工学、理学学位)] 0702[理学-物理学] 

基  金:Funded by the Science and Technology Department Program of Guizhou Province (ZK162 and 2325) the Special Project of"Doctor Professor Service Group of Kaili University (BJFWT201906) the Cultivation Project of Guizhou University of China (37) the Camellia Engineering Technology Research Center of Guizhou Province (5252) 

主  题:Camellia oleifera protein epoxy resin crosslinking wood adhesive 

摘      要:Epoxy resin (EPR) was used to crosslink with Camellia oleifera *** to prepare wood adhesive,and the bonding performance and curing characteristics of which were mainly investigated,and the synthesis mechanism was also discussed by using model *** experimental results show that EPR can significantly improve the bonding performance of Camellia oleifera ***-based adhesive,and the maximum of which reaches 0.72 MPa satisfies the strength requirement of Type II plywood in GB/T *** alkali treatment,the protein can more easily crosslink with EPR at low curing temperature,and the adhesive has high degree of crystallinity of curing products,high degree of crosslinking reaction,and high bonding *** reaction mechanism of EPR-modified Camellia oleifera *** adhesive can be divided into resinification phase and curing phase.

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