An Improved Planar Module Automatic Layout Method for Large Number of Dies

作     者：Puqi Ning Xuhui Wen Lei Li Han Cao 

作者机构：Institute of Electrical EngineeringChinese Academy of SciencesBeijing100190 China Collaborative Innovation Center of Electric Vehicles in Beijing 

出 版 物：《CES Transactions on Electrical Machines and Systems》 (中国电工技术学会电机与系统学报（英文）)

年 卷 期：2017年第1卷第4期

页      面：411-417页

学科分类：0401[教育学-教育学] 04[教育学] 

基　　金：This work is supported by The National key research and development program of China(2016YFB0100600) the Key Program of Bureau of Frontier Sciences and Education,Chinese Academy of Sciences(QYZDBSSW-JSC044) the National Natural Science Foundation of China(No.51507166) 

主　　题：Multi-chip module packaging. 

摘      要：The layout of power modules is one of the key points in power module design,especially for silicon carbide module,which may parallel more devices compared with silicon *** this paper,along with the design example,a improved layout design method for planar power modules is *** practical considerations and implementations are also introduced in the optimization of module layout design.