Non-spherical abrasives with ordered mesoporous structures for chemical mechanical polishing

作     者：Peili Gao Tingting Liu Zhenyu Zhang Fanning Meng Run-Ping Ye Jian Liu 郜培丽;刘婷婷;张振宇;孟凡宁;叶闰平;刘健

作者机构：Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of EducationDalian University of TechnologyDalian 116024China State Key Laboratory of CatalysisDalian Institute of Chemical PhysicsChinese Academy of SciencesDalian 116023China DICP-Surrey Joint Centre for Future MaterialsDepartment of Chemical and Process Engineeringand Advanced Technology InstituteUniversity of SurreySurrey GU27XHUnited Kingdom 

出 版 物：《Science China Materials》 (中国科学（材料科学（英文版）)

年 卷 期：2021年第64卷第11期

页      面：2747-2763页

核心收录：

学科分类：07[理学] 070205[理学-凝聚态物理] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0703[理学-化学] 0702[理学-物理学] 

基　　金：the National Key R&D Program of China(2018YFA0703400) the Xinghai Science Funds for Distinguished Young Scholars Thousand Youth Talents at Dalian University of Technology,the Collaborative Innovation Center of Major Machine Manufacturing in Liaoning,Liaoning BaiQianWan Talents Program Dalian National Laboratory for Clean Energy(DNL),DNL Cooperation Fund,Chinese Academy of Sciences(DNL180402) 

主　　题：non-spherical abrasives mesoporous structure chemical mechanical polishing interfacial mechanochemistry 

摘      要：The chemical mechanical polishing(CMP)technology has been widely used for surface modification of critical materials and components with high quality and *** a typical CMP process,the mechanical properties of abrasives play a vital role in obtaining the ultra-precision and damage-free surface of wafers for improvement of their *** this work,a series of fine structured rod-shaped silica(RmSiO2)-based abrasives with controllable sizes and diverse ordered mesoporous structures were synthesized via a soft template approach,and successfully applied in the sustainable polishing slurry for improving the surface quality of cadmium zinc telluride(CZT)*** with commercial silica gel,solid and mesoporous silica spheres,the RmSiO2 abrasives present superior elastic deformation capacity and surface precision machinability on account of their mesoporous structures and rod ***,ultra-precision surface roughness and relatively effective material removal speed were achieved by the CMP process using the RmSiO2 abrasives with a length/diameter(L/d)ratio of *** addition,a potential CMP mechanism of the developed polishing slurry to CZT wafer was elucidated by analyzing X-ray photoelectron spectra and other *** proposed interfacial chemical and mechanical effects will provide a new strategy for improving abrasives’machinability and precision manufacture of hard-to-machine materials.