Preparation and application of gallium-based conductive materials in the very recent years

作     者：WANG XinPeng GUO JiaRui HU Liang WANG XinPeng;GUO JiaRui;HU Liang

作者机构：Beijing Advanced Innovation Center for Biomedical EngineeringBeihang UniversityBeijing 100191China 

出 版 物：《Science China(Technological Sciences)》 (中国科学（技术科学英文版）)

年 卷 期：2021年第64卷第4期

页      面：681-695页

核心收录：

学科分类：0810[工学-信息与通信工程] 08[工学] 080501[工学-材料物理与化学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0702[理学-物理学] 0812[工学-计算机科学与技术（可授工学、理学学位）] 

基　　金：supported by the 111 Project(Grant No.B13003) the National Natural Science Foundation of China(Grant No.81801794) the Open Laboratory Foundation of the Chinese Academy of Sciences(Grant No.CRY0201915)。 

主　　题：liquid metal conductive materials fabrication techniques flexible electronics 

摘      要：Gallium and its alloys are a group of metallic materials with low-melting points at or around room temperature.Apart from the good electrical conductivity,the unique liquid state endows those metals with excellent compliance and self-healing capacity,which present great value in the development of flexible and stretchable electronics.Constrained by the high surface tension and low viscosity,however,liquid metals cannot be applied to some common microelectronics manufacturing technologies such as micro-electro mechanics in the preceding years,which impedes their mass production in electronic devices.To address these issues and broaden the applications of liquid metals in electronics devices,numerous efforts have been taken and great progress has been made especially in the very recent years.This review summaries the recent development of liquid metal-based conductive materials from the aspects of preparation or modification methods and their accommodative fabrication techniques in flexible electronic applications.Further outlook including expectations and challenges of liquid metal-based conductive materials are also presented.