Preface to the Special Issue on Beyond Moore:Three-Dimensional(3D)Heterogeneous Integration

作     者：Yue Hao Huaqiang Wu Yuchao Yang Qi Liu Xiao Gong Genquan Han Ming Li Yue Hao;Huaqiang Wu;Yuchao Yang;Qi Liu;Xiao Gong;Genquan Han;Ming Li

作者机构：School of MicroelectronicsXidian UniversityXi’an 710071China Institute of MicroelectronicsTsinghua UniversityBeijing 100084China Department of Micro/nanoelectronicsPeking UniversityBeijing 100871China Frontier Institute of Chip and SystemFudan UniversityShanghai 200438China Department of Electrical and Computer EngineeringNational University of SingaporeSingapore 117546Singapore Institute of SemiconductorsChinese Academy of SciencesBeijing 100083China 

出 版 物：《Journal of Semiconductors》 (半导体学报（英文版）)

年 卷 期：2021年第42卷第2期

页      面：1-2页

核心收录：

学科分类：080903[工学-微电子学与固体电子学] 0809[工学-电子科学与技术（可授工学、理学学位）] 08[工学] 0702[理学-物理学] 

主　　题：Integration scaling integrate 

摘      要：In the past few decades,the Moore’s Law has been the revolutionary force for our integrated circuit(IC)industry.However,the tremendous challenges faced in continuous transistor physical down-scaling and the unprecedented demands for computing and storage capabilities require our urgent search for strategies and solutions to integrate diverse materials,devices,circuits,and architectures in a 3D vertically stacked manner so that they can orchestrate in the most effective way to provide significantly enhanced functionalities as well as superior speed,energy,bandwidth,form fact,and cost.