Broadband vectorial ultrathin optics with experimental efficiency up to 99%in the visible region via universal approximators
作者机构：PRIMALIGHTFaculty of Electrical EngineeringApplied Mathematics and Computational ScienceKing Abdullah University of Science and TechnologyThuwal 23955-6900Saudi Arabia
出 版 物：《Light(Science & Applications)》 (光（科学与应用)（英文版）)
年 卷 期：2021年第10卷第3期
页 面：420-433页
核心收录：
学科分类：0808[工学-电气工程] 070207[理学-光学] 0809[工学-电子科学与技术（可授工学、理学学位）] 07[理学] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0803[工学-光学工程] 0702[理学-物理学]
摘 要：Integrating conventional optics into compact nanostructured surfaces is the goal of flat *** the enormous progress in this technology,there are still critical challenges for real-world applications due to the limited operational efficiency in the visible region,on average lower than 60%,which originates from absorption losses in wavelengththick(~500 nm)*** issue is the realization of on-demand optical components for controlling vectorial light at visible frequencies simultaneously in both reflection and transmission and with a predetermined wavefront *** this work,we developed an inverse design approach that allows the realization of highly efficient(up to 99%)ultrathin(down to 50 nm thick)optics for vectorial light control with broadband input-output responses in the visible and near-IR regions with a desired wavefront *** approach leverages suitably engineered semiconductor nanostructures,which behave as a neural network that can approximate a user-defined input-output *** performance results from the ultrathin nature of these surfaces,which reduces absorption losses to nearnegligible ***,we discuss polarizing beam splitters,comparing their performance with the best results obtained from both direct and inverse design techniques,and new flat-optics components represented by dichroic mirrors and the basic unit of a flat-optics display that creates full colours by using only two subpixels,overcoming the limitations of conventional LCD/OLED technologies that require three subpixels for each composite *** devices can be manufactured with a complementary metal-oxide-semiconductor(CMOS)-compatible process,making them scalable for mass production at low cost.
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