Film-induced Tensile Stress during CorrosionProcess for α-Ti

作     者：Hong LU Kewei GAO and Wuyng CHU(Dept. of Materials Physics, University of Science and Technology Beijing, Beijing 100083, China) 

作者机构：Dept. of Materials Physics University of Science and Technology Beijing Beijing 100083 China 

出 版 物：《Journal of Materials Science & Technology》 (材料科学技术（英文版）)

年 卷 期：1998年第14卷第4期

页      面：294-298页

核心收录：

学科分类：081704[工学-应用化学] 07[理学] 0817[工学-化学工程与技术] 0806[工学-冶金工程] 08[工学] 0805[工学-材料科学与工程（可授工学、理学学位）] 0703[理学-化学] 0802[工学-机械工程] 070301[理学-无机化学] 0801[工学-力学（可授工学、理学学位）] 0702[理学-物理学] 

主　　题：Film-induced Tensile Stress during CorrosionProcess for Ti SCC 

摘      要：The α-Ti foil with protective layer in one side bended to corrosion surface gradually during corrosion process in 0.1 mol/L H2SO4, while the passive film was formed, i.e., a tensile stress was developed in the surface layer of the sample. The extra tensile Stress grew gradually, whose maximum value is =313 MPa (average of 5 samples), which is near or reaches the yield stress. The extra tensile stress would be added to the load Stress during SCC to facilitate the emission and motion of dislocation, so that SCC cracks could nucleate in lower Stress(or lower KI).